From March 17 to 19 local time, OFC2026 (the 51st Optical Fiber Communication Conference and Exhibition), the world’s premier event for the optical communications industry, concluded successfully at the Los Angeles Convention Center, USA. This year’s edition centered on key industry hotspots including high-speed optical interconnect for AI data centers, CPO (Co-Packaged Optics), and ultra-high-density cabling, bringing together global leading manufacturers to explore innovations in computing infrastructure and set the pace for the explosive growth of AI computing power.
OTRANS COMMUNICATION TECHNOLOGIES made a strong appearance with a full range of optical interconnect solutions tailored for AI data centers at Booth #5219. With cutting-edge technical solutions, exquisite craftsmanship, and superior user experience, our booth attracted continuous visits and negotiations from global customers, earning widespread praise and valuable cooperation intentions, and fully demonstrating the hardcore strength of a Chinese passive optical component brand on the global stage.
As computing power of large language models surges, 100G/200G applications have become mainstream, 400G/800G deployments are scaling up, and 1.6T high-speed interconnect has entered the mass production era. AI data centers are imposing increasingly stringent demands for high-density cabling, rapid deployment, low loss, high stability, and flexible scalability. Meanwhile, the rapid advancement of CPO technology has further driven full-link upgrades of rack interconnection, fiber jumper connections, and backbone transmission, rendering traditional cabling solutions inadequate to meet the extreme interconnect requirements of large-scale AI clusters.
With profound insights into industry trends and years of expertise in AI data center optical interconnects, OTRANS launched a full lineup of products at this exhibition, directly targeting the three core pain points of high density, high efficiency, and high reliability. We provide end-to-end passive optical interconnect solutions for AI computing infrastructure, perfectly matching rack interconnection and cabling needs in scenarios involving high-speed optical modules and CPO packaging.
The highlight of OTRANS’ exhibition was undoubtedly the SP-PRO Series High-Density Patch Panels designed for AI computing cluster cross-connect. Custom-built for high-speed interconnection across the full rate range from 100G/200G to 400G/800G/1.6T, this series is paired with a variety of MTP/MPO fiber jumper modules to thoroughly resolve the challenges of high-density rack cabling.
Extreme Density Breakthrough: A single 1HU rack supports up to 144-core MPO/432-core MDC jumper connections and rack cabling, doubling space utilization. It is ideally suited for intensive cabinet deployment in hyperscale AI data centers, maximizing machine room space efficiency.
User-Friendly Plug-and-Play Design: Featuring a smooth front-and-rear plug-in mode that eliminates the complexity of traditional cabling structures, it drastically shortens on-site installation and maintenance time, improves deployment efficiency, and reduces labor costs—perfect for rapid expansion and batch maintenance in data centers.
Full-Scenario Jumper Compatibility: We showcased a complete range of fiber jumper modules, including 8/12/16/24-core MTP/MPO-LC and MTP/MPO-MDC options. These modules comply with mainstream interface standards, flexibly matching interconnections between AI servers and switches of different speeds and architectures, delivering exceptional versatility.
Beyond outstanding performance, the SP-PRO Series boasts upgraded materials and manufacturing techniques: a sleek silver-gray coating for a premium finish, rigid chassis and drawer structures, smooth-sliding rails, delicate cable management rings, and transparent tray panels that combine aesthetics and functionality. Every detail reflects meticulous craftsmanship, winning unanimous recognition from customers worldwide.
In addition to the core SP-PRO cabling solution, OTRANS presented a host of cutting-edge new products, building a full industry chain layout from backbone transmission and terminal connectivity to cabling management. These products cater to diverse scenarios such as AI data centers, FTTR whole-home fiber, and broadband access, and are deeply aligned with the technological iteration of CPO and high-speed optical interconnects.
✅ Backbone Cable Assemblies
The 864-core MPO backbone cable assembly and 144-core LC backbone cable assembly made their debut, supporting ultra-large-capacity transmission with low loss and high stability. They seamlessly handle high-speed data exchange between AI clusters, ideal for backbone cabling in hyperscale data centers.
✅ High-Performance Connectivity Components
Short-boot pull-type MPO/LC fiber connectors: Easy to plug and pull with high tensile strength, perfect for narrow spaces in high-density cabinets;
Duplex/quadruple LC fiber adapters with built-in dust caps, and tool-free polarity-adjustable MPO fiber adapters: Enhanced dust protection and hassle-free installation with efficient polarity tuning;
16-core ultra-low-loss MPO fiber connectors and 16-core single-mode ultra-low-loss MT ferrules: Minimize transmission loss to ensure lossless transmission of 1.6T and higher-speed signals, meeting the high-precision interconnect requirements of CPO packaging.
✅ Innovative Featured Products
Invisible indoor fiber and wall-penetrable SC fiber connectors for residential deployment solve common cabling headaches in home decoration; 144-core MDC & SN fiber connection panels, and 48-port 8-module high-speed copper cable patch panels further enrich high-density interconnect solutions, supporting both optical and copper deployments to build a diversified computing interconnect ecosystem.
Our successful participation in OFC2026 is not only a showcase of OTRANS’ technological prowess and product innovation, but also a key milestone in our global layout. Amid the optical interconnect super-cycle driven by AI computing power, OTRANS remains committed to technological innovation and quality excellence, focusing on customer needs to continuously iterate and upgrade passive optical interconnect products. Keeping pace with cutting-edge trends such as CPO and high-speed optical modules, we deliver more efficient, reliable, and convenient full-scenario optical interconnect solutions for global AI data centers, telecom carriers, and integrators.
Moving forward, OTRANS will continue to deepen its presence in the optical communications field, forge premium products with craftsmanship, and expand boundaries through innovation. We are dedicated to accelerating the development of global computing infrastructure, and joining hands with industry partners to build a new high-speed optical interconnect ecosystem for the AI era.
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